MEMS Technology

With over 20 years of experience in microsystems fabrication using MEMS technologies, we have developed a valuable array of technologies designed to realize your MEMS device. Deep reactive ion etching and and wafer bonding are key amongst these vital enabling technologies.

Through continual development in our state of the art cleanroom we have refined existing technologies and continue to develop new custom capabilities in partnership with our customers.

You will find an overview of all of our most important MEMS technologies and building blocks below.

Get in touch to talk to our team about your MEMS technology requirements

scanning electron microscope image (SEM) image of a silicon on insulator SOI MEMS

Silicon on Insulator Wafers (SOI) Processing

Silicon on insulator wafers (SOI wafers) offer excellent performance for advanced MEMS devices. Our SOI processing includes deep reactive ion etching, release etch, bonding and etch back and trench fill process.