LioniX International
  • Home
  • Photonics
    • Photonic IC Development
      • Photonic integrated circuit design
      • Photonic integrated circuit modules
      • Photonics foundry for scalable volume
    • Photonic IC technology
      • TriPleX® Silicon Nitride Waveguides
      • Photonic packaging and assembly
      • MEMS with photonics
    • MPW services
      • MPW 1550nm
      • MPW 850nm
      • MPW dates
      • Book your MPW spot!
    • Applications
      • AR/VR
      • Integrated microwave photonics
      • Optical coherence tomography
      • Optical phased arrays
      • Photonic biosensor
      • Quantum photonics
      • Ultra-narrow linewidth tunable laser
  • MEMS
    • Custom MEMS development & production
      • MEMS process development and engineering
      • Custom MEMS production and fabrication
      • MEMS services
      • MEMS Design Support
    • MEMS technology
      • Deep Reactive Ion Etching for MEMS
      • Wafer Level Packaging of MEMS
      • TriPleX® integrated photonics for optical MEMS
      • Silicon on Insulator Wafers (SOI) Processing
      • Ion Sensitive Field-Effect Transistor (ISFET)
      • Cantilevers for MEMS
    • MEMS Processes
      • LPCVD
      • PECVD Processes
      • Deep Reactive Ion Etching for MEMS
      • Lithography
      • Wet etching
      • Wafer bonding
      • Evaporation
      • Sputtering
      • Oxidation
      • Back End Processes
    • MEMS applications
      • MEMS sensors & instrumentation
      • BioMEMS
      • Inertial MEMS
      • Microfluidics
      • Micromachining
      • Optofluidics
    • MEMS Solutions
      • Bronkhorst – Gas flow sensor
      • ESA – Life Marker Chip
      • Evonetix – Synthesized DNA
      • Microsens – pH sensors with ISFET chips
      • MBARI – ISFET for deep sea pH sensor
      • Onset – Conductivity sensor
      • PerfectEdge TEM Membranes
      • SmartTip – CIPT probes
      • ThermoFisher – SEM specimen heating and biasing holder
      • University of Strasbourg – MEMS Microfluidic Optical Cavities
  • Markets
    • Defense
    • Artificial Intelligence (AI)
    • Space
    • Telecom/datacom
    • Life science
    • Metrology
    • Instrumentation
  • About us
    • Blog
    • News
    • Events
    • Newsletter subscription
    • Publications
    • R&D projects
    • People
    • Work at LioniX International
  • Contact Us
  • Menu Menu
Home » About us » R&D projects » TERAWAY
ABOUT THIS PROJECT:

Terahertz technology for ultra-broadband and ultra-wideband operation of backhaul and fronthaul links in systems with SDN management of network and radio resources.

TERAWAY will develop a disruptive generation of THz transceivers that can overcome the current limitations of THz technology and enable its commercial uptake. Leveraging optical concepts and photonic integration techniques, TERAWAY will develop a common technology base for the generation, emission and detection of wireless signals within an ultra-wide range of carrier frequencies that will cover the W (92-114.5 GHz), D (130-174.8 GHz) and THz band (252-322 GHz).

In this way, the project will provide for the first time the possibility to organize the spectral resources of a network within these bands into a common pool of radio resources that can be flexibly coordinated and used. In parallel, the use of photonics will enable the development of multi-channel transceivers with amplification of the wireless signals in the optical domain and with multi-beam optical beamforming in order to have a radical increase in the directivity of each wireless beam.

At the end of this development, TERAWAY will make available a set of truly disruptive transceivers including a 2- and a 4-channel module with operation from 92 up to 322 GHz, data rate per channel up to 108 Gb/s, transmission reach in the THz band of more than 400 m, and possibility for the formation of wireless beams that can be independently steered in order to establish backhaul and fronthaul connections between a set of fixed and moving nodes.

TERAWAY will evaluate these transceivers under an application scenario of communication and surveillance coverage of outdoor mega-events using moving nodes in the form of drones that will carry a gNB or the radio part of it. The network during the implementation of this scenario in the 5G testbed of AALTO will be controlled by an innovative SDN controller that will perform the management of the network and radio resources in a homogeneous way with large benefits for the network performance, energy efficiency, slicing efficiency and possibility to support heterogeneous services.

THE ROLE OF LIONIX INTERNATIONAL:

LioniX International will identify the desired operation requirements and system performance for the TERAWAY transmitter and translate these into optimal signal processing and chip configuration for Multibeam Optical Beamforming. After that LioniX International will be actively involved in component integration and assembly process for TERAWAY modules. Another of the key roles is the design and the fabrication of TriPleX® chips for the transmitter part of TERAWAY transceivers. Furthermore, the required analogue optical link performance and the requirements for on chip signal processing will be investigated, and will translate these into the functional chip design. LioniX International will design and fabricate the TriPleX® based Optical Beamformer/Beamsteering Unit.

FURTHER INFORMATION:

Find more information about this project and its progress on the Teraway website.

Published results:
  • InP-Si3N4 Hybrid Integrated Optical Source for High-purity Mm-wave Communications
    Luis Gonzalez-Guerrero, Robinson Guzman, Muhsin Ali, Jessica Cesar Cuello, Devika Dass, Colm Browning, Liam Barry, Ilka Visscher, Robert Grootjans, Chris G. H. Roeloffzen, Guillermo Carpintero
    Publisher: Optical Fiber Communication Conference (OFC) 2022, S. Matsuo, D. Plant, J. Shan Wey, C. Fludger, R. Ryf, and D. Simeonidou, eds., Technical Digest Series (Optica Publishing Group, 2022), paper W3D.7., DOI: 10.1364/OFC.2022.W3D.7
  • Photonic Integrated Circuits for Terahertz Communication: The Hybrid Integrated Microwave Photonic approach
    Guillermo Carpintero, Luis González, Robinson Guzmán, Muhsin Ali, David de Felipe, Tianwen Qian, Norbert Keil, Robert Grootjans, Chris Roeloffzen
    Publisher: Optical Fiber Communication Conference 2021 (OFC 2021), Washington, DC United States. DOI: 10.5281/zenodo.5638278
  • Widely Tunable RF Signal Generation Using an InP/Si3N4 Hybrid Integrated Dual-Wavelength Optical Heterodyne Source
    Robinson Guzmán, Luis González, Alberto Zarzuelo, Jessica Cesar Cuello, Muhsin Ali, Ilka Visscher, Robert Grootjans, Jörn P. Epping, Chris G. H. Roeloffzen, Guillermo Carpintero
    Publisher: IEEE Journal of Lightwave Technology, vol. 39, no. 24, pp. 7664-7671, 15 Dec.15, 2021, DOI: 10.1109/JLT.2021.3078508.
  • True Time Delay Optical Beamforming Network Based on Hybrid InP-Silicon Nitride Integration
    Christos Tsokos, Efstathios Andrianopoulos, Adam Raptakis, Nikolaos K. Lyras, Lefteris Gounaridis, Panos Groumas, Roelof Bernardus Timens, Ilka Visscher, Robert Grootjans, Lennart Wefers, Dimitri Geskus, Edwin Klein, Hercules Avramopoulos, René Heideman, Christos Kouloumentas, and Chris G. H. Roeloffzen
    Publisher: IEEE Journal of Lightwave Technology; DOI: 10.1109/JLT.2021.3089881.

You can find our full list of publications here.

Latest Blog Items

  • Fabrication and Assembly of an AR/VR Light-Engine Prototype in Project MatEl31 July 2025 - 11:59
  • LioniX TriPleX silicon nitride external cavity laser
    New Photonic Integrated Tuneable EC Laser with PZT Actuators22 January 2025 - 10:55
  • DEMUX PIC assemblyLioniX International
    Reconfigurable (DE)MUX Filter for Flexible Frequency Allocation4 November 2024 - 14:34
  • LioniX silicon nitride chip
    Quantum scientists give Triplex® a HUG to entangle single photons1 May 2024 - 16:52
  • LioniX dual hybrid InP/Si3N4 laser assembly
    Want lower RF drift? Double down on laser PICs!22 April 2024 - 15:55

Latest News Items

  • Behind the scenes with RTV Oost’s ToekomstMakers26 June 2026 - 11:19
  • Our CEO is the latest guest on the Manufacturing Matters podcast!16 April 2026 - 09:52
  • Global Photonics Engineering Contest 20269 February 2026 - 16:52
  • EU Invests €15M to Help Companies Supercharge Their Products with Light16 April 2025 - 13:23
  • The image shows a render of LioniX new facility.
    LioniX International is moving to a new purpose-built facility in Enschede, The Netherlands9 December 2024 - 15:37

LioniX International BV

PO Box 456
7500 AL Enschede
The Netherlands

Visiting address

Hengelosestraat 527
7521 AG Enschede
The Netherlands

Contact details

Phone: +31 53 20 30 053
E-mail: info@lionix-int.com

© Copyright - LioniX International
  • Link to LinkedIn
  • Link to Youtube
  • Disclaimer
  • Privacy Policy
Link to: Post-deadline paper on narrow linewidth tunable laser Link to: Post-deadline paper on narrow linewidth tunable laser Post-deadline paper on narrow linewidth tunable laser Link to: SpaceBeam Link to: SpaceBeam SpaceBeam
Scroll to top Scroll to top Scroll to top