LioniX International
  • Home
  • Photonics
    • Photonic IC Development
      • Photonic integrated circuit design
      • Photonic integrated circuit modules
      • Photonics foundry for scalable volume
    • Photonic IC technology
      • TriPleX® Silicon Nitride Waveguides
      • Photonic packaging and assembly
      • MEMS with photonics
    • MPW services
      • MPW 1550nm
      • MPW 850nm
      • MPW dates
      • Book your MPW spot!
    • Applications
      • AR/VR
      • Integrated microwave photonics
      • Optical coherence tomography
      • Optical phased arrays
      • Photonic biosensor
      • Quantum photonics
      • Ultra-narrow linewidth tunable laser
  • MEMS
    • Custom MEMS development & production
      • MEMS process development and engineering
      • Custom MEMS production and fabrication
      • MEMS services
      • MEMS Design Support
    • MEMS technology
      • Deep Reactive Ion Etching for MEMS
      • Wafer Level Packaging of MEMS
      • TriPleX® integrated photonics for optical MEMS
      • Silicon on Insulator Wafers (SOI) Processing
      • Ion Sensitive Field-Effect Transistor (ISFET)
      • Cantilevers for MEMS
    • MEMS Processes
      • LPCVD
      • PECVD Processes
      • Deep Reactive Ion Etching for MEMS
      • Lithography
      • Wet etching
      • Wafer bonding
      • Evaporation
      • Sputtering
      • Oxidation
      • Back End Processes
    • MEMS applications
      • MEMS sensors & instrumentation
      • BioMEMS
      • Inertial MEMS
      • Microfluidics
      • Micromachining
      • Optofluidics
    • MEMS Solutions
      • Bronkhorst – Gas flow sensor
      • ESA – Life Marker Chip
      • Evonetix – Synthesized DNA
      • Microsens – pH sensors with ISFET chips
      • MBARI – ISFET for deep sea pH sensor
      • Onset – Conductivity sensor
      • PerfectEdge TEM Membranes
      • SmartTip – CIPT probes
      • ThermoFisher – SEM specimen heating and biasing holder
      • University of Strasbourg – MEMS Microfluidic Optical Cavities
  • Markets
    • Defense
    • Artificial Intelligence (AI)
    • Space
    • Telecom/datacom
    • Life science
    • Metrology
    • Instrumentation
  • About us
    • Blog
    • News
    • Events
    • Newsletter subscription
    • Publications
    • R&D projects
    • People
    • Work at LioniX International
  • Contact Us
  • Menu Menu
Home » About us » R&D projects » Quantify

Quantum Enhanced Photonic Integrated Sensors For Metrology

About Quantify:

Project QUANTIFY aims to advance quantum sensing beyond classical limits by developing highly integrated, user-friendly photonic quantum sensors for real-world applications.

The project focuses on creating key building blocks and quantum-enhanced techniques for chip-scale optical clocks, optically pumped magnetometers, and optomechanical temperature sensors. By combining multiple photonic integrated platforms through advanced hybrid integration, QUANTIFY will bring essential optical and optomechanical functionalities onto a single chip. A central innovation is the development of an integrated squeezed-light source to boost sensor performance beyond classical capabilities, with broader relevance for photonic quantum computing. Additionally, the project will demonstrate a novel absolute temperature sensor operating from cryogenic to room temperatures using nanoscale optomechanics. Through precise photonic integration and dispersion engineering, QUANTIFY aims to improve sensor reproducibility, while its interdisciplinary consortium, including metrology institutes, will benchmark performance against existing standards and contribute to new metrological procedures.

Figure 1. Hybrid integration in multidisciplinary technology and its applications

Objectives of the project:

  • Develop a photonic integrated squeezed light source (PICSq)
  • Develop a quantum-enhanced optically pumped magnetometer (OPM) using a photonic-integrated squeezer and miniaturized atomic vapor cells
  • Develop a miniaturized quantum-enhanced TPOC with PIC and MEMS components
  • Develop a photonic/phononic integrated Quantum Enhanced Temperature sensor
  • Assess and characterize the metrological performance of quantum-enhanced sensors

Figure 2. Representation of the PICSq chip

The Role of LioniX International:

  • Realization of SiN circuitry for targeted applications and coupling to the gain chip:
  1.  Design and fabrication of the sensor motherboard, including a laser cavity in Triplex®, together with electrical circuitry for power and wavelength tuning.
  2.  Realization of spot-size converters, alignment, and gluing for coupling the gain section to the Triplex®, depending on the sensor requirements.
  3.  Dedicated circuitry (power splitters and filters), and one or multiple gain sections will be implemented to achieve the desired wavelenghts and power levels.
  • Creation of dedicated sensing windows to access the SiN circuitry to enable microtransfer printing.
  • Defining key laser specifications (wavelength, power output, tunability, and linewidth) based on the application performances.
  • Delivering a narrow-linewidth photonic integrated tunable laser at 780 nm and 1550 nm.

FURTHER INFORMATION:

🌐 Visit the project’s website for all the details of the full objectives and project partners

LioniX International BV

PO Box 456
7500 AL Enschede
The Netherlands

Visiting address

Hengelosestraat 527
7521 AG Enschede
The Netherlands

Contact details

Phone: +31 53 20 30 053
E-mail: info@lionix-int.com

© Copyright - LioniX International
  • Link to LinkedIn
  • Link to Youtube
  • Disclaimer
  • Privacy Policy
Link to: Your MPW request is on its way! Link to: Your MPW request is on its way! Your MPW request is on its way! Link to: University of Strasbourg – MEMS Microfluidic Optical Cavities Link to: University of Strasbourg – MEMS Microfluidic Optical Cavities LioniX International MEMS Fabri-Perot cavity in a flowcell configurationUniversity of Strasbourg – MEMS Microfluidic Optical Cavities
Scroll to top Scroll to top Scroll to top