LioniX International
  • Home
  • Photonics
    • Photonic IC Development
      • Photonic integrated circuit design
      • Photonic integrated circuit modules
      • Photonics foundry for scalable volume
    • Photonic IC technology
      • TriPleX® Silicon Nitride Waveguides
      • Photonic packaging and assembly
      • MEMS with photonics
    • MPW services
      • MPW 1550nm
      • MPW 850nm
      • MPW dates
      • Book your MPW spot!
    • Applications
      • AR/VR
      • Integrated microwave photonics
      • Optical coherence tomography
      • Optical phased arrays
      • Photonic biosensor
      • Quantum photonics
      • Ultra-narrow linewidth tunable laser
  • MEMS
    • Custom MEMS development & production
      • MEMS process development and engineering
      • Custom MEMS production and fabrication
      • MEMS services
      • MEMS Design Support
    • MEMS technology
      • Deep Reactive Ion Etching for MEMS
      • Wafer Level Packaging of MEMS
      • TriPleX® integrated photonics for optical MEMS
      • Silicon on Insulator Wafers (SOI) Processing
      • Ion Sensitive Field-Effect Transistor (ISFET)
      • Cantilevers for MEMS
    • MEMS Processes
      • LPCVD
      • PECVD Processes
      • Deep Reactive Ion Etching for MEMS
      • Lithography
      • Wet etching
      • Wafer bonding
      • Evaporation
      • Sputtering
      • Oxidation
      • Back End Processes
    • MEMS applications
      • MEMS sensors & instrumentation
      • BioMEMS
      • Inertial MEMS
      • Microfluidics
      • Micromachining
      • Optofluidics
    • MEMS Solutions
      • Bronkhorst – Gas flow sensor
      • ESA – Life Marker Chip
      • Evonetix – Synthesized DNA
      • Microsens – pH sensors with ISFET chips
      • MBARI – ISFET for deep sea pH sensor
      • Onset – Conductivity sensor
      • PerfectEdge TEM Membranes
      • SmartTip – CIPT probes
      • ThermoFisher – SEM specimen heating and biasing holder
      • University of Strasbourg – MEMS Microfluidic Optical Cavities
  • Markets
    • Defense
    • Artificial Intelligence (AI)
    • Space
    • Telecom/datacom
    • Life science
    • Metrology
    • Instrumentation
  • About us
    • Blog
    • News
    • Events
    • Newsletter subscription
    • Publications
    • R&D projects
    • People
    • Work at LioniX International
  • Contact Us
  • Menu Menu
Home » About us » R&D projects » Flagship

About Project Flagship:

Project Flagship is a PhotonDelta-funded effort for a stronger, more collaborative, and better-connected Dutch integrated photonics ecosystem. The competences and capacities of the ecosystem, including chip design, chip manufacturing, assembly, packaging, and testing, will be pooled together to prepare integrated photonics modules for the final frontier: outer space!

Devices that are bound for outer space must be small, light, and power-efficient to reduce the cost of their transport and upkeep. Photonic integrated circuits (PICs) make for a perfect technology to upgrade the design and production of space-related devices. However, the harsh conditions of space travel will test the devices in ways unthinkable on Earth, whether in terms of the violent vibrations experienced by payloads as their escape the atmosphere, or the extremely low temperatures, or the constant exposure to radiation. Additionally, devices in space are typically not maintained, so they must be functional for the entirety of their functional lifetime.

For these and other reasons, the quality standards for space are the highest among industrial applications. Many of these standards also apply for other fields where integrated photonics show a lot of promise, such as medical and automotive industries. Through this effort, the Dutch photonics ecosystem will be brought to a higher level of maturity to make the grade for these standards. Project Flagship will test and improve the reliability, performance, scalability, and manufacturability for medium to high volume PIC modules. By setting the bar at the height of space-ready devices, challenges and improvements in the ecosystem will be identified and implemented. The insight resulting from the work of the project is expected to be inspirational for the work of all involved parties. Besides testing and demonstrating the maturity of the Dutch photonic ecosystem, the project will help LioniX International and consortium members reach their development roadmap milestones faster and more confidently.

The Role of LioniX International:

LioniX International chairs the project as the oldest member of the consortium with experience in space applications in its past and current record. In this capacity, we will take care of administrative aspects of the project and facilitate smooth collaboration between Dutch ecosystem project members. We will also lead the consortium in our collective work on system architecture and configuration design. As the most mature platforms in integrated photonics with proven functionality, indium phosphide and TriPleX® silicon nitride will comprise the photonic chips of the modules. These platforms are already key technologies in product development for satcom and terrestrial beamforming applications. We will apply our expertise in circuit design on both platforms, and we will fabricate and supply the silicon nitride circuits. We will advise on the design of the control electronics and drivers as well as the final package containing both photonic and electronic components. We will also help with chip testing and characterization, chip and fiber assembly, and PCB design for photonic chips control.

Further information:

🌐 PhotonDelta’s report on Flagship kick-off

🌐 Smart Photonics’s project page

🌐 PHIX Photonic Assembly’s project page

🌐 ESA Life Marker Chip

🌐 Project SPACEBEAM: applying photonic modules to sattelite communication

🌐 Project 5G-PHOS: applying photonic modules to terrestrial telecommunication

Latest Blog Items

  • Fabrication and Assembly of an AR/VR Light-Engine Prototype in Project MatEl31 July 2025 - 11:59
  • LioniX TriPleX silicon nitride external cavity laser
    New Photonic Integrated Tuneable EC Laser with PZT Actuators22 January 2025 - 10:55
  • DEMUX PIC assemblyLioniX International
    Reconfigurable (DE)MUX Filter for Flexible Frequency Allocation4 November 2024 - 14:34
  • LioniX silicon nitride chip
    Quantum scientists give Triplex® a HUG to entangle single photons1 May 2024 - 16:52
  • LioniX dual hybrid InP/Si3N4 laser assembly
    Want lower RF drift? Double down on laser PICs!22 April 2024 - 15:55

Latest News Items

  • Behind the scenes with RTV Oost’s ToekomstMakers26 June 2026 - 11:19
  • Our CEO is the latest guest on the Manufacturing Matters podcast!16 April 2026 - 09:52
  • Global Photonics Engineering Contest 20269 February 2026 - 16:52
  • EU Invests €15M to Help Companies Supercharge Their Products with Light16 April 2025 - 13:23
  • The image shows a render of LioniX new facility.
    LioniX International is moving to a new purpose-built facility in Enschede, The Netherlands9 December 2024 - 15:37

LioniX International BV

PO Box 456
7500 AL Enschede
The Netherlands

Visiting address

Hengelosestraat 527
7521 AG Enschede
The Netherlands

Contact details

Phone: +31 53 20 30 053
E-mail: info@lionix-int.com

© Copyright - LioniX International
  • Link to LinkedIn
  • Link to Youtube
  • Disclaimer
  • Privacy Policy
Link to: POLYNICES Link to: POLYNICES POLYNICESLogo for Project POLYNICES Link to: PARALIA Link to: PARALIA PARALIA
Scroll to top Scroll to top Scroll to top